3M Thermal Bonding Film 583 is activated by heat or solvents. It is flexible, it is easily used by removing the liner and placing the adhesive between two surfaces. Sticking is done by heat and pressure using a heated press, a hot laminator or similar equipment.

3M Polyimide Film Tape 5413 is used to mask printed circuits in the bonding process and other applications at high temperatures up to 260°C. Delays the spread of the flame, shows excellent resistance to radiation and chemicals, protecting the surfaces.